Leo Lambert will host the Assembly & Joining Processes Committee planning meeting on Sunday, April 10, 2011, at APEX 2011 in Las Vegas, Nevada. This is a planning meeting for the task group and subcommittee leaders of the Assembly and Joining Processes Committees.
Leo Lambert manages the course offerings and IPC Certification programs at EPTAC Corporation, offering expert consultation in electronics manufacturing, covering areas such as RoHS/WEEE and lead-free issues. As the IPC General Chairman for the Assembly/Joining Process Committee, he plays a crucial role in overseeing standards and specifications in assembly, soldering, and related materials.
Leo previously served as the Chair of the Technical Activities Executive Committee for IPC and currently holds the position of General Chair of the Assembly & Joining Committee. This committee is responsible for overseeing all standards and specifications related to assembly, soldering, and related materials.
Leo has been actively involved in IPC since 1976 and received the prestigious IPC Presidents Award in 1988 for his significant contributions to the Surface Finish plated through the whole solderability program. Additionally, he has been recognized with multiple Distinguished Committee Service awards, Committee Leadership awards, and Service Committee awards.
EPTAC is an internationally recognized leader in solder training and IPC certification, providing professionals with the skills to accelerate their careers and businesses and the talent to succeed. For over 35 years, EPTAC has been helping corporations increase quality standards, improve productivity, and maximize profits.
With 24 locations in North America, EPTAC continues to expand its offerings and exceptional instructional staff to provide easy access to knowledge and skill-based programs when and where the industry demands it. Access our scheduled programs through our website or schedule your own corporate on-site training. For more information, call 800.643.7822 or contact us.