Ask Helena & Leo

Question: Is the IPC’s J-STD-001 going to be replacing or taking a precedence over the NASA STD 8739.4?

Question: We were looking over the J-STD-001 and the Space Addendum requirements for partially visible or hidden solder connections 4.18.3. Why does the space addendum give you the option to x-ray the parts in Note D, but in the J-STD-001 book...

Question: I am training my first space addendum class in a few weeks and would like to know how I get the certificate for the specialists I train? They all currently have a valid certificate in the J-STD-001 plus 1 other module. I have a...

Question: I am looking for an institute that can teach how to set up individual reflow oven profiles for products. Do you offer anything like this?

Question: Are there any specifications for designing a PCB layout in regards to the conformal coating process?

Question: Since IPC-A-610 calls out magnification ranges, do scopes have to be calibrated/validated on a periodic basis? I never recall one being out.

Question: Is it acceptable to piggyback non-glass embodied MELF components per Class 3 of IPC-A-610?

Question: If the gold plating on the surface of via holes is not removed from the printed circuit boards, does this constitute a defect or failure of the board’s acceptance in final assembly?

Question: What are the prerequisites for the J-STD-001 Train the Trainer?

Question: What J-STD-001 modules are needed in order to be able to take the Space Addendum?

Question: Quite often we have discussions about application of no clean solder and cleaning the flux off the board. We would like to put together a training course that talks about this. Do you have any information that you could direct us to?

Question: We are having and issue with the conformal coating not adhering to the Teflon wire that we use in units. Is there anything in the IPC-A-610 or the J-STD-001 that allows the conformal coat not to adhere to Teflon wire?