Soldertips

Question:  We have been stumped by occasional opens at the corner balls of some BGA components after reflow. We have experimented with many minor adjustments, yet this occasional problem continues. Do you have any suggestions? Answer: Based upon the warp and twist characteristics of the printed board laminate materials and the BGA, this could be a […]

Question:  We assemble simple through hole circuit boards. What are the main factors to consider when shifting from hand soldering to wave soldering? What factors should be used to justify continuing to hand solder vs. switching to wave soldering? Answer: Manual soldering is a very unique process with many variables and people being one of them. […]

Question:  Does the IPC have guidelines or recommendations on flux selection and use? Answer: You ask a very interesting question regarding the selection of flux or fluxes and whether or not IPC provides information or dictates where certain fluxes can and cannot be used.  The answer is NO, IPC will not provide information as to which […]

Question:  We have been conducting operator training for both J-STD-001 and IPC-A-610 to the Revision D documents. Can you tell me when the training materials will be available for Revision E and if I have to retrain everyone to the new revision? Answer:  There are really two parts to address this question, one is the […]

Question:  Do you have a topic or issue you would like us to discuss in an upcoming webinar? Answer:  If the answer is yes, then we need you to send us an email. For the past three years of webinars, yes, three years, EPTAC has been delivering webinars based on our experience in working with […]

Question:  When will the new revisions for the IPC-A-610 and J-STD-001 documents be available? Answer:  J-STD-001E is now available. IPC-A-610E will be available in April, really sometime soon. J-STD-001E is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for lead free manufacturing, in addition to easier to […]

Question:  We have a switch that gets wave soldered during the assembly process, but it does not always stay flush with the printed circuit board. Is there a specification that describes how to measure flushness or what the acceptability requirements are for this type of part? Possible Solution:  The final criterion for any component is […]

Question:  Can you give me a basic definition of the differences between Class 2 and Class 3 products and where these differences show up in the IPC documents? Possible Solution:  Class 2 products are defined as products where continued performance and extended life are required and for which uninterrupted service is desired, but not critical. […]

Question:  We are using a Kester 186 RMA Flux for our assembly process. Can you tell me if you have to clean an RMA flux and what the issues are if we do not? Possible Solution:  You don’t have to clean an RMA Flux. The flux hardens and can be left on. The problem most […]

Question:  We are attempting to hand solder through hole components in a very thick board, but are finding that the solder does not flow through to the other side of the board.  Is there a method or technique I need to use to accomplish this? Possible Solution:  Manual soldering of thick boards is a very […]

There are many reasons for insufficient fill of a PTH (Plated Through Hole) and the occurrence of voids in barrels.  Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect.  Let’s look at these two problems and a few possible reasons for them. […]