Yes, we are still discussing this issue. It seems to continue to appear. Someone, somewhere has found voids in their solder joints on BGAs, or other surface mounted components. What are you suppose to do? In this session we will take a look at the causes and cures for voids and how process setups, such as your stencil, can be leveraged to reduce the amount of flux entrapment on large scale surface mount areas to deal with solder joint voids and their presence.
Topics we will be reviewing are:
Discussions on some of the causes and cures.
Review of IPC-A-610 criteria for BGA and SMT components.
Samples of x-ray images and what they are saying to us.
List of papers and studies on the topic for further review.