Webinars

We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too? Give us a moment to explain this issue, why it is required, when it is necessary and how removal is usually performed.

You may or may not be aware that the IPC has released Amendments to the popular IPC-A-610F and J-STD-001F, but you may not be aware that they contain not only corrections to the current document revisions, but additional requirements not previously mentioned in the existing standards.

We receive, almost on a daily basis, questions regarding production issues, standards and specification interpretation and just plain old, what is wrong with this manufacturing process. During this webinar, we would like to share some of the issues that other production people ...

IPC-6012 “Qualification and Performance Specification for Rigid Printed Boards” has been around for a while, but what you might not know, is that this document provides the foundation for the requirements that are found in the IPC-A-600 “The Acceptability of Printed Boards”.

Yes, this simple term “discernible” is still debated to this day by many in the electronics manufacturing industry and a continually confusing concept for new students to grasp. Used throughout IPC-A-610 and J-STD-001, understanding this definition is critical to the application of the standards and their principles to the production process.

Yes, we all know that you should be tinning your soldering iron tips between times of usage, but do you really understand the fundamentals of doing so, how it impacts heat transfer, time on a board pad and ultimately the quality of the solder joint and reliability of the component itself?

So you have been crimping terminals to wires for years. Find the wire size, match it with the specified crimp terminal and you are on your way. Right? Well there is a bit more to it. What size terminal do you use if you have multiple wires being placed in one crimped terminal?

Ceramic chip capacitors have been around for years and used in a variety of assemblies, but as their size has shrunk over time, their susceptibility to damage has continued to rise. Add to this, the transition to lead free soldering materials, which have imposed more rigidity and reduced flexibility on solder joints, resulting in additional stress issues on these small devices.