Webinars

Magnet wire has been used for years in the electronics industry in everything from transformers, inductors, motors, electromagnets and on and on. What you may not know is that all coatings are not created equal and some wires can have multiple layers of poly insulating films on them.

Yes, we have all heard that flux is your friend in the soldering process, but considering the multitude of chemistries out there and the ever-changing applications, a flux could quickly turn into an enemy and a detriment to your process and the longevity of a product.

Did you ever wonder why there are all these requirements in IPC-A-610, J-STD-001, IPC-7711/7721, or for that matter any of the other IPC design or manufacturing standards? If you are looking for the “devil in the details” well you have found it.

You’ve heard the saying “the world is shrinking.” Well, in more ways than you think. With the ever increasing proliferation of smart, hand held and mobile devices and the continued shrinking of the electronics they hold, you have to know that there is an ever increasing demand for the electronic devices that make this all possible. The BGA.

The year is half over and in looking back; we receive numerous questions every day from our customers and visitors to our site. Some are very application or process specific and others are common stumbling blocks or issues we run into from day to day. So we thought we would compile a list of our Top 10 and rattle them off to you.

Part 2 in this series, has everything to do with Surface Mount Technology, or more importantly surface mount components. In the previous discussion we explained that the majority of these solder joints fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment. We continue with this series.

Have you ever wondered if you have created the perfect solder joint, or for that matter one that is strong enough for the particular application it is being used in? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment.

We hear it all the time and you probably do as well. Are we building to J-STD-001 or IPC-A-610? Are we inspecting to IPC-A-610 or J-STD-001? Do these standards even play well together? How do I determine which standard is applicable to what I am doing? Are there other documents that I should be looking at as well, like IPC/WHMA-A-620, IPC-A-600, or for that matter IPC-6012? Confusing or confused?