Webinars

Are you having laminate separation issues with your printed circuit boards? Delamination is showing up more and more today due to increased thermal pressures on assemblies. So how do you address these issues? Learn how this occurs in the production and assembly process, how to deal with it and understand the difference between true delamination and other forms of separation such as measling, haloing and crazing.

So many questions and so little time. We receive multiple questions each and every day and they continue to build regarding soldering assembly, procedures, materials and chemistry. Take a moment to hear our top 5 questions and time permitting allow us to answer a few of yours. Who knows, we may solve a puzzler for you. This webinar will focus more on wave soldering concerns.

With so many program and course offerings out there it is hard to decipher what you may or may not need to meet your everyday operational requirements, let alone any certifications you may need for contractual obligations. Let us take some time to demystify the IPC offerings by enlightening you on what the programs are and who may need them.

Coming off of the recent discussion, you should be starting to realize that inspection is not so much applying the accept/reject criteria of IPC-A-610 "Acceptability of Electronic Assemblies", though it is key, but rather being able to alter your thought process to allow you to visually identify subtle deviations in the norm and then apply the criteria. So let's look at a practical way of sitting down and inspecting a printed circuit board by spotting differences and categorizing them.

So you understand IPC-A-610 "Acceptability of Electronic Assemblies" and are ready to inspect, but where do you start as you stare at a printed circuit board assembly fresh from the line? It can be a daunting task, but if you know how to look, what to look for each pass and how to focus in on problem areas, you can increase your effectiveness and perform inspections in a timely manner. Learn some of the tricks and techniques on how to inspect assemblies and identify problematic production trends.

You are probably aware of IPC-A-610 "Acceptability of Electronic Assemblies" which covers the accept/reject criteria for stuffed printed circuit boards, but you may not be aware that there are other standards that help you deal with issues relative to bare printed boards covering design, fabrication and inspection. We take a look at IPC-A-600, IPC-6012 and other standards that can be crucial to support your efforts from start to finish in the fabrication process of the most critical component in your assembly.

The Accept/Reject Criteria for soldered joints right? That is what IPC-A-610 "Acceptability of Electronic Assemblies" is all about. Well, yes and no. There is a lot more that goes into an assembly than just soldered connections. This HARD(ware) from the board, screws, wire, handles, latched, heat sinks and formed components all have criteria that must be met by IPC-A-610 too. This webinar takes a look at these requirements and their impact on a final assembly.