We receive questions on a daily basis, some relative to training and certification, but the bulk on process issues and whether they are acceptable based on the standards or not. Ever wonder if you were the only one dealing with a particular problem? Well you are not alone. In this webinar we will break down a variety of topics and work to shed some light on how to address them in your design and production process.
Some of the topics are bulleted below, but they all share a common thread. Are they acceptable or not? In each one, we will try to help with the interpretation of the specifications, resolve any conflicts between what is actually occurring and what the specification calls out, and hopefully end with a concise answer to add clarity to the criteria trying to be achieved.
Join us in this webinar where we discuss spec interpretation, conflict resolution, and solutions to some of the most commonly asked questions we receive.
Topics we will be reviewing are:
Solder balls within unsupported location holes and interference.
Conductor width and exposed base material acceptability.
Solder mask bubbles, mask flaking and why they may occur.
RoHS as it relates to cables and plastic coatings.